AFOX DDR4 8G 2133 UDIMM memory module 8 GB 1 x 8 GB 2133 MHz

AFOX DDR4 8G 2133 UDIMM memory module 8 GB 1 x 8 GB 2133 MHz

19,00
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Broj rata Mjesečni iznos
2
9,50
3
6,33
4 -
6 -
12 -
-3% dodatnog popusta

= 18,43€ uz plaćanje odjednom (osim Diners i PayPal)

= 18,43€ uz plaćanje odjednom (osim Diners i PayPal)

Nedostupno Nedostupno
nije dostupno Ronis Čakovec - Galerija sjever
nije dostupno Ronis Zagreb - Velesajam
nije dostupno Ronis Varaždin - skladište
nije dostupno Ronis Zagreb - Velesajam
Features Certification: CE Internal memory type: DDR4 Memory form factor: 288-pin DIMM Refresh row cycle time: 260 ns CAS latency: 15 Memory clock speed: 2133 MHz Compatible chipsets: Intel® H110 Buffered memory type: Unregistered (unbuffered) Component for: PC/Server Memory voltage: 1.2 V Internal memory: 8 GB Memory bandwidth (max): 17 GB/s Memory layout (modules x size): 1 x 8 GB Row cycle time: 46.5 ns Row active time: 33 ns ECC: No Memory channels: Dual-channel JEDEC standard: Yes Programming power voltage (VPP): 2.5 V Operational conditions Operating temperature (T-T): 0 - 85 °C Storage temperature (T-T): -55 - 100 °C Other features Chips organisation: x8 FBGA DRAM chip Packaging data Package weight: 36 g Package width: 88 mm Package height: 168 mm Sustainability Sustainability certificates: RoHS Weight & dimensions Height: 31 mm Width: 133 mm Weight: 18 g
Prikaži više
Šifra: 103480
EAN: 4897033783521
Više o proizvodu
Jamstvo
60 mjeseci
Features Certification: CE Internal memory type: DDR4 Memory form factor: 288-pin DIMM Refresh row cycle time: 260 ns CAS latency: 15 Memory clock speed: 2133 MHz Compatible chipsets: Intel® H110 Buffered memory type: Unregistered (unbuffered) Component for: PC/Server Memory voltage: 1.2 V Internal memory: 8 GB Memory bandwidth (max): 17 GB/s Memory layout (modules x size): 1 x 8 GB Row cycle time: 46.5 ns Row active time: 33 ns ECC: No Memory channels: Dual-channel JEDEC standard: Yes Programming power voltage (VPP): 2.5 V Operational conditions Operating temperature (T-T): 0 - 85 °C Storage temperature (T-T): -55 - 100 °C Other features Chips organisation: x8 FBGA DRAM chip Packaging data Package weight: 36 g Package width: 88 mm Package height: 168 mm Sustainability Sustainability certificates: RoHS Weight & dimensions Height: 31 mm Width: 133 mm Weight: 18 g